We are strongly-equipped with the expertise to perform plating of Nickel on various metal substrates through our well-established chemical process, without the use of electrical currents.
Our understanding of the specific requirements Electroless Nickel plating has allowed us to fine-tune our process to yield the highest quality of Nickel-plated goods in the market.
|Process||Specification||Process Classification||Tank Size (mm)
(L) x (W) x (H)
||AMS 2404 / ASTM B 733 / AMS-C-26074 / MIL-C-26074||Medium phosphorous EN||1530 x 760 x 930||Singapore|
|High phosphorous EN||1200 x 600 x 1200|
|EN Teflon||720 x 450 x 700|
|AMS 2404 / ASTM B 733 / AMS-C-26074 / MIL-C-26074||Medium phosphorous EN (Alu)||1100 x 700 x 1000||Penang|
|Medium phosphorous EN (Steel)||1800 x 700 x 1300|
|High phosphorous EN||1100 x 700 x 1000|
|EN Teflon||Ø 200 x 160|
Electroless nickel (EN) plating is an auto-catalytic reaction used to build up a coating of nickel on a substrate. Unlike electroplating, it is not necessary to pass an electric current through the chemical to form a deposit. This plating technique is usually used to prevent corrosion and wear.
Electroless nickel plating has many advantages as compared to electroplating. Electroless nickel provides a uniform deposit regardless of part geometry as it is free from flux-density and power supply issues. Moreover, with proper pre-plate catalyst, EN can deposit on non-conductive surfaces.