Copper plating is an electrochemical process used to coat copper on metal substrates to minimize corrosion. Besides Nickel, Copper is also frequently used plated metal that provides a soft, red, ductile and solderable surface.
|Process||Specification||Process Classification||Tank Size (mm)
(L) x (W) x (H)
|Copper Plating||MIL-C-14550||Class 0, 1, 2, 3 & 4||640 x 400 x 700|
|Remarks: Please contact us directly for tank size other than the specified.|