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Gold Plating

Gold plating is frequently used in electronic components, such as electrical connectors and printed ciscuit boards, to provide a corrosion-resistant electrically conductive layer on copper substrate.

With direct gold-on-copper plating, the copper atoms diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide and/or sulfide layer.

A layer barrier metal, often nickel, is deposited on the copper substrate before the gold plating. The layer of nickel provides mechanical base for the gold layer to improve its wear resistance and reduces the impact of pores seen in the gold layer.

Singapore Plant

Process
Specification
Process Classification
Tank Size (mm)
(L) x (W) x (H)
Gold Plating MIL-G-45204 Hard Gold 250 x 400 x 400
Soft Gold 250 x 400 x 400
Remarks: Please contact us directly for tank size other than the specified.

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