Gold plating is frequently used in electronic components, such as electrical connectors and printed ciscuit boards, to provide a corrosion-resistant electrically conductive layer on copper substrate.
With direct gold-on-copper plating, the copper atoms diffuse through the gold layer, causing tarnishing of its surface and formation of an oxide and/or sulfide layer.
A layer barrier metal, often nickel, is deposited on the copper substrate before the gold plating. The layer of nickel provides mechanical base for the gold layer to improve its wear resistance and reduces the impact of pores seen in the gold layer.
|Process||Specification||Process Classification||Tank Size (mm)
(L) x (W) x (H)
|Gold Plating||MIL-G-45204||Hard Gold||250 x 400 x 400|
|Soft Gold||250 x 400 x 400|
|Remarks: Please contact us directly for tank size other than the specified.|